By Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)
Advanced turn Chip Packaging offers prior, current and destiny advances and traits in parts akin to substrate expertise, fabric improvement, and meeting tactics. turn chip packaging is now in common use in computing, communications, buyer and automobile electronics, and the call for for turn chip expertise is constant to develop as a way to meet the necessity for items that supply greater functionality, are smaller, and are environmentally sustainable.
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5%Cu Additives, Ni, Bi, etc. UBM Ni /Au Plated (Amkor) NiVAu (Freescale) ENIG (Pac Tech) Cu Pillar (Intel) Seed (Adhesion) Ti (Intel, Amkor) TiW (IBM) Cr + e-Cu (for plating) Dielectric 2 PSPI BCB (Amkor) Epoxy (on Cu Pillar) Redistribution Ti/Cu/Ti Al Dielectric 1 PSPI (IBM, Amkor) BCB (Amkor) OxiNitride BEOL Cu (Intel) Al (IBM) Dielectric 2 Redistribution Dielectric No Al Device prior to Fig. 15 Wafer Level Chip Scale Package elements Research and Development consortiums are emerging as means to collaborate among companies while reducing the individual R&D costs.
SIP’s are also designed using a 3D stacking of chips with following elements; thinned dies up to 40 mm thick, adhesive-with-silicon filled in between the chips and between the first chip and laminate, first chip may also be joined with underfill, wire bonding between the chips and flip chip between the first chip and carrier, low modulus mold compound encapsulating the wires, and organic carrier with ball grid array pitch >400 mm, (Fig. 18). H. Bottoms from ITRS has summarized classification for SIP structures, as shown in Fig.
Lu M et al (2008) Comparison of electromigration performance for Pb-free solders and surface finishes. Proceedings of 58th ECTC, Orlando, May 2008 23. Jan CH et al (2008) A 45 nm low power system-on-chip technology with dual gate (logic and I/O) high-k/metal gate strained silicon transistors. 4, Dec 2008 24. Moore G (1975) Progress in digital integrated electronics. IEDM Tech Digest, pp 11–13 25. Zhang GQ et al (2006) Strategic research agenda of more than moore. EuroSime 2006, 24–26 Apr 2006 26.
Advanced Flip Chip Packaging by Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)